Mai haɗa katin SD ɗin turawa, H2.75mm, tare da fil ɗin CD KLS1-SD112
Bayanin Samfura Mai haɗa katin SD na turawa,H2.75mm,tare da fil fil CD Abu:Housing:High Temperate Thermoplastic. Contact: Copper Alloy. Shell: Alloy na jan karfe, Zinare da aka zana akan wutsiyar solder, Nickel mara nauyi a kan duka. Plating: Wurin tuntuɓar: Gilashin Zinare akan Ni. Solder Tail:30u" Min Sn Plated Over Ni. Electrical: Current Rating: 0.5A. Voltage Rating:250VRMS Resistance Contact:40mΩ Dielectric Tsarewar Wutar Lantarki:500V AC. Tsarewar Insulation:100M&Ome...
Mai haɗa katin SD tura tura, H2.8mm, tare da fil ɗin CD KLS1-SD-001 / KLS1-SD-101
Bayanin samfur Mai haɗa katin SD na tura tura,H2.8mm,tare da fil fil CD Abu: Insulator:High Temperatuur Thermoplastic,UL94V-0. Contact:Copper Alloys.Plated 50u" Ni Overall Plated Au Selective Contact Area,Plated 100u" Sn Over Ni On Solder Area. Shell: Plated 50u" Ni Gabaɗaya
Bayanin samfur Micro SD 4.0 mai haɗin katin tura turawa Abu: Filastik: LCP, Thermoplastic UL94V-0.Black. Contact: Copper Alloy. Shell: Bakin Karfe. Plating: Area Contact:Au 3u" Sama da Ni 50u". Yankin wutsiya mai siyarwa: Matted Tin 80u" Min. Sama da Ni 50u". Solderability: Over Plating Ni 50" Sama da Duka. Sashe No. Bayanin PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order
Mai haɗa katin Micro SD tura tura, H1.28mm, tare da fil ɗin CD KLS1-SD113
Bayanin Samfura Mai haɗa katin katin Micro SD tura tura,H1.28mm,tare da fil fil CD Abu: Insulator:High Temperatuur Thermoplastic LCP SZ6505,UL94V-0,Black. Contact:Berylliun Copper (7035-TM06,T=0.15mm),Plated 80u"min Ni gaba daya plated 1u"min Au sama da Ni akan wurin saida. Shell:SUS301-3/4H T=0.10mm.Solder wutsiya plated 1u" min Au overll 50u" min Ni. Lantarki: Matsayin Yanzu: 0.5A AC/DC max. Ƙimar Wutar Lantarki: 12V AC/DC Yanayin Humidity Rage: 95% RH ...
Mai haɗa katin Micro SD tura tura, H1.68mm, tare da fil ɗin CD KLS1-SD114
Bayanin samfur Mai haɗa katin katin Micro SD, tura turawa,H1.68mm,tare da fil ɗin CD Abu: Insulator:Hi-Temperature Plastic,UL94V-0,Black. Tasha: Alloy Copper, Zinare filashin zinari akan wurin lamba & wutsiya mai siyarwa. Shell: Bakin Karfe, Nickel da aka yi a kan allover, walƙiya na zinariya akan wutsiya mai siyarwa. Wutar Lantarki: Juriyawar Insulation: 1000MΩ Min./500V DC Tsarewar Wutar Lantarki:250V AC/minti. Juriya na Tuntuɓi: 100mΩ Max.AT 20mA/20mV Matsakaicin Matsayin Yanzu: 0.5 A Wutar Lantarki...
Bayanin Samfura Mai haɗin katin SD na tura turawa,H1.85mm,Buɗewa Kullum Wutar Lantarki: ƙimar lamba na yanzu:0.5A Max. Juriya na lamba: 100mΩ Max. Resistance Insulation: 250V DC ko 300V AC na ƙasa da minti 1 Tsawon Mating: 10000 Cycles Min. Ƙarfin shigarwa: 2.0kgf max. Ƙarfin haɓakawa: 0.5kgf min. Zazzabi Mai Aiki: -25ºC~+85ºC Sashe Na A'a. Bayanin PCS/CTN GW(KG) CMB(m3) OrderQty. Tsarin Lokaci
Mai haɗa katin Micro SD mai turawa, H1.5mm, tare da fil ɗin CD KLS1-SD104
Bayanin Samfura Mai haɗin katin SD mai ƙwanƙwasa,H1.5mm,tare da bayanan fil na CD: Takaddun bayanai na Coplanarty.Ga duk wutsiyoyi masu siyarwa da gammaye masu siyarwa shine 0.1mm max. Halayen Wutar Lantarki: Matsayin Yanzu:0.5 Amp.MAX. Ƙarfin wutar lantarki:100V DC.MAX Ƙarƙashin Ƙarfafa Tuntuɓi:100mΩ Max.Da farko. Dielectric Tare da Wutar Lantarki: 500V AC MIN.Na minti 1. Juriya na Insulation: (Na farko) 1000MΩ Min. (Na ƙarshe) 100MΩ Min. Yanayin Aiki: -45ºC~+105ºC Durabilit...
Mai Haɗin Katin SIM Biyu, PUSH PULL, H3.0mm KLS1-SIM2-002A
Bayanin Samfura Mai Haɗin Katin SIM Biyu, PUSH PULL, H3.0mm Material: Housing: Hi-TEMP Plastic, UL94V-0.Black. Terminal: Copper Alloy Shell: Bakin Karfe Gama: Terminal: Au Plated a kan wurin lamba, Matte tin plated a kan wutsiyar solder da ke ƙasa a kan nickel Shell: Au Plated a kan wutsiyar solder da ke ƙarƙashin nickel Electrical: Resistance lamba: 50mΩ Max Tsarewar ƙarfin lantarki: 350V AC1 mitsi juriya: 1000M & Om...
Nano SIM Card Connector;MID Dutsen Tray type,6Pin,H1.5mm,tare da CD Pin KLS1-SIM-100
Bayanin Samfura Nano Mai Haɗin Katin SIM;MID Dutsen Tray Nau'in,6Pin,H1.5mm,tare da CD Pin Material: Filastik:LCP,UL94V-0.Black. Tuntuɓi: C5210 Shell: SUS304 Tire: LCP, UL94V-0.Black. Plating: Contact: Contact Area:G/F Plating;Soldertail Area:80u" Matte Tin Shell:Plating over 30u" NiSolderable 30u" Ni Plating over all.Contact and tail coplanarity to be 0.10mm all. Part No. Description PCS/CTN GW(KG) Order CMB(m3)
Mai Haɗin Katin Nano SIM, 6Pin, H1.4mm, Nau'in Hinged, Tare da CD Pin KLS1-SIM-101
Bayanin Samfura Nano Mai Haɗin Katin SIM, 6Pin, H1.4mm, Nau'in Hinged, Tare da Kayan CD Fil: Gidaje: Babban Zazzabi Thermoplastic, UL94V-0.Black. Tasha: Alloy na Copper, Zinare Plated akan wurin tuntuɓar da wutsiyoyi masu siyarwa, Nickel ɗin da ba a cika ba. Shell: Bakin Karfe, Gilashin Zinare akan wutsiyar siyarwar, Nickel ɗin da ba a saka ba akan duka. Wutar Lantarki: Ƙididdigar halin yanzu: 0.5A Matsakaicin Ƙarfin Wutar Lantarki: 30V Adawar AC: 100mΩ Max. Juriya na Insulation: 1000MΩ Min./500V...
Mai Haɗin Katin Nano SIM, 6Pin, H1.4mm, Nau'in Hinged, Tare da CD Pin KLS1-SIM-077A
Bayanin Samfura Nano Mai Haɗin Katin SIM,6Pin,H1.4mm,Nau'in Hinged,tare da Kayan CD Fil: Insulator:High Temperate Thermoplastic,UL94V-0. Contact: Copper Alloy, Plated 50u" Ni Overall Contact All Au 1U. Shell:SUS.All Ni 30U MIN. Electrical: Current Rating:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Na yanayi Humidity Range:95% RH Max. Resistance lamba: 80mΩ00 Min./100V DC Mating Cycles: 5000 Yana aiki ...