Mai haɗa katin Micro SD tura tura, H1.85mm, tare da fil ɗin CD KLS1-TF-003D
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Mai haɗa katin Micro SD tura tura, H1.85mm, tare da fil ɗin CD
Abu:
Insulator: Babban Zazzabi Thermoplastic, LCP, UL94V-0.
Contact: Copper Alloy T = 0.15, Plated 50u" Ni Gabaɗaya.
Plated Au Selective Contact Area Plated 30u”-70u” Sn Sama da Ni A Wurin Solder.
Plated Au Selective Contact Area Plated 30u”-70u” Sn Sama da Ni A Wurin Solder.
Shell:T=0.15,Plated 30u”Ni Gabaɗaya min.Plated 0.5u” Au Selective Contact Area
Lantarki:
Matsayi na yanzu: 0.5mA amx.
Ƙimar wutar lantarki: 3.3V
Yanayin Yanayin Yanayin:95% RH Max.
Resistance lamba: 100mΩ Max.
Juriya na Insulation: 1000MΩ Min./500VDC
Mating Cycles: 5000 Shigarwa.
Yanayin Aiki: -45ºC~+105ºC
