Mai haɗa katin Micro SD Nau'in Hinged,H1.9mm KLS1-TF-017
Hotunan Samfura Bayanin Samfura Mai haɗa katin katin Micro SD Nau'in Hinged,H1.9mm Material: Insulator:High Zazzabi Thermoplastic Flammability Raring,UL94V-0,Black. Lamba: Copper Alloys Murfin: Bakin Karfe Tuntuɓe Area Plating: Zinariya Voer Ni Solder Tail Coplanarity Dole ne Ya kasance tsakanin 0.10MAX.
Mai haɗa katin Micro SD tura tura, H1.4mm, tare da fil ɗin CD KLS1-TF-016
Hotunan Samfurin Bayanin Samfuran Mai haɗa katin katin Micro SD na turawa,H1.4mm,tare da CD fil Bayanan kula: 1.Coplanarity spec.ga duk tsayin solder da solder pad shine 0.10mm 2.Halayen lantarki: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltage: 100V DC max. 2-3.Low matakin juriya juriya: 100mΩ Max. 2-4.Dielectric Tsarewar Wutar Lantarki: AC500V rms. 2-5.Tsarin juriya: 1000MΩ Min. (Na ƙarshe) 100MΩ Min. 3.Mechanical halaye: 3-1.Durability: 5000 Cycles. 3-2.Aikin Zazzabi: -45ºC~+105ºC ...
Mai haɗa katin Micro SD mai turawa, H1.42mm, tare da fil ɗin CD KLS1-TF-015
Hotunan Samfuran Bayanin Samfuran Mai haɗa katin SD Micro SD,H1.42mm,tare da CD fil Abu: Karfe harsashi:Bakin Karfe,Nickel gabaɗaya 50u"Housing:Liouid crystal polymer,UL94V-0,Black.Tsarin lamba:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold.1u" Gano Terminal:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold 1u" Min. Canja Tashar:Phosphor Bronze.Tsarin: Filashin Zinariya; Wutsiya Mai Soja: Zinariya 1u" Min.
Mai haɗa katin Micro SD mai turawa, H1.8mm KLS1-TF-014
Hotunan Samfurin Bayanin Samfurin Mai haɗa katin Micro SD mai turawa, Tsawon 1.8mm, Fakitin Roll. Abu: Gidaje: LCP, UL94V-0, Baƙar fata. Tasha: Alloy na Copper, Zaɓaɓɓen Zinare akan Yankin Mating. Shell:Iron Lantarki: Ƙimar Wutar Lantarki:5V Matsayin Yanzu:0.5 A Max. Resistance lamba: 100mΩ Max. Juriya na Insulation: 1000MΩ Min. Tsawon Wutar Lantarki: 500V 1 Minti. Durability: 10000 Zagaye.
Mai haɗa katin Micro SD tura tura, H1.4mm, tare da fil ɗin CD KLS1-TF-012
Hotunan Samfura Bayanin Samfura Mai haɗa katin katin Micro SD tura tura,H1.4mm,tare da fil fil CD Abu: Insulator:High Temperate Thermoplastic,UL94V-0. Tasha: Alloy Copper, Plated 50u” Ni Gabaɗaya. Plated Au Selective Contact Area Plated 100u” Sn Over Ni On Selder Area. Shell:Plated 50u”Ni Gabaɗaya.Plated Au Selective Contact Area Electrical: Rating na yanzu:0.5 A AC/DC max. Ƙimar wutar lantarki:125V AC/DC Yanayin yanayi: 95% RH Max. Resistance lamba: 100mΩ Max. Ins...
Mai Haɗin Katin Micro SD; Nau'in Hinged, H1.5mm & H1.8mm KLS1-TF-007
Hotunan Samfura Bayanin Samfura Mai Haɗin Katin Micro SD;Nau'in Hinged,H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Tasha: Alloy na Copper.AU Plating akan duk wurin tuntuɓar tasha, da plating a kan yankin wutsiya na solder. Shell: Bakin Karfe. Wutar Lantarki: Matsayin Yanzu: 0.5 A Ƙimar Wutar Lantarki: 5.0 vrms Juriya na Insulation: 1000MΩ Min./500V DC Tsarewar Wutar Lantarki:250V AC Na minti 1. Juriya na Tuntuɓi: 100mΩ Max.AT 10mA/20mV Maxaukar zafin aiki: -45ºC ~...
Mid Dutsen Micro SD katin haɗin tura tura, H1.8mm, tsoma tare da CD fil KLS1-TF-003E
Hotunan Samfur Bayanin Samfura Tsakanin Dutsen Micro SD mai haɗa katin tura tura, H1.8mm, tsoma tare da fil ɗin CD Abu: Gidaje: Babban Zazzabi Thermoplastic, UL94V-0, Baƙar fata. Terminal: Alloy na Copper. Shell: Bakin Karfe. Tuntuɓi: Wurin Lamba: Au G/F, Yankin Solder: Matte tin 80u” Min; Ƙarƙashin farantin Ni 30u” Min duka. Fannin CD: Wurin Lamba: Au G/F, Ƙarƙashin farantin Ni 30u” Min duka. Lantarki: Rated halin yanzu: 1.0 A Rated Voltage: 30V Resistance Tuntuɓi 50mΩ Max. Insulation Resistance:100...
Mai haɗa katin Micro SD tura tura, H1.85mm, tare da fil ɗin CD KLS1-TF-003D
Hotunan Samfura Bayanin Samfura Mai haɗa katin katin Micro SD tura tura,H1.85mm,tare da fil fil CD Abu: Insulator:High Temperate Thermoplastic,LCP,UL94V-0. Contact:Copper Alloy T=0.15,Plated 50u”Ni Overall.Plated Au Selective Contact Area Plated 30u”-70u”Sn Over Ni On Solder Area.Shell:T=0.15,Plated 30u”Ni Overall min. Plated 0.5u” Au Selective Contact Area Electrical: Rating na yanzu:0.5mA amx. Ƙimar wutar lantarki:3.3V Nauyin Humidity Range:95% RH Max Co...
Micro SD katin haɗin tura tura, H1.85mm, tare da CD fil, GOLD KLS1-TF-003C
Hotunan Samfurin Bayanin Samfura Mai haɗa katin katin Micro SD tura tura,H1.85mm,tare da fil ɗin CD,Gold Abu: Insulator:High Temperature Thermoplastic,LCP,UL94V-0. Contact:Copper Alloy T=0.15,Plated 50u”Ni Overall.Plated Au Selective Contact Area Plated 30u”-70u”Sn Over Ni On Solder Area.Shell:T=0.15,Plated 30u”Ni Overall min. Plated 0.5u” Au Selective Contact Area. Lantarki: Matsayin Yanzu: 0.5mA AC/DC amx. Ƙimar wutar lantarki: 125V AC/DC Humidity Ran...
Mid Dutsen Micro SD katin haɗin tura tura, H1.8mm, tare da CD fil KLS1-TF-003A
Hotunan Samfura Bayanin Samfura Tsakanin Dutsen Micro SD mai haɗa katin tura tura,H1.8mm,tare da fil fil CD Abu: Insulator:High Temperate Thermoplastic,UL94V-0. Lamba: Alloy Copper, Plated 50u” Ni Gabaɗaya. Plated Au Selective Contact Area Plated 100u” Sn Over Ni On Solder Area. Shell: Plated 50u” Ni Gabaɗaya. Plated 1u” Au Selective Contact Area. Lantarki: Matsayin Yanzu: 0.5mA AC/DC amx. Ƙimar Wutar Lantarki: 125V AC/DC Yanayin Yanayin Yanayin: 95% RH Max. Tuntuɓi Resi...
Mai haɗa katin Micro SD tura tura, H1.85mm, tare da fil ɗin CD KLS1-TF-003
Hotunan Samfura Bayanin Samfura Mai haɗa katin katin Micro SD tura tura,H1.85mm,tare da fil fil CD Abu: Insulator:High Temperate Thermoplastic,UL94V-0. Contact:Copper Alloy T=0.15,Plated 50u”Ni Overall.Plated Au Selective Contact Area Plated 30u”-70u”Sn Over Ni On Solder Area.Shell:T=0.15,Plated 30u”Ni Overall min. Plated 0.5u” Au Zaɓan Yankin Tuntuɓar Wutar Lantarki: Matsayin Yanzu: 0.5 Matsayin Wuta: 3.3V Rawan Humidity: 95% RH Max. Sake tuntuɓar...
Mai Haɗin Katin Micro SD; Nau'in Hinged, H1.9mm KLS1-TF-002
Hotunan Samfuran Bayanin Samfura Mai Haɗin Katin SD Micro; Nau'in Hinged, H1.9mm Material: Kayan Gida: LCP UL94V-0 Abubuwan Tuntuɓi: Kunshin-Bronze: Tef da Reel Kunshin Lantarki Halayen: Ƙimar wutar lantarki: 100V AC Matsayin Yanzu: 0.5V/Ac1: Matsakaicin ƙarfin lantarki: 0.5A ≥1000ΜΩ Juriya na tuntuɓa: ≤30MΩ Rayuwa: 5000 Zazzabi Yanayin Zazzabi: -45ºC ~+105ºC
Mai haɗa katin Micro SD tura tura, H1.85mm, Kullum rufe KLS1-TF-001B
Hotunan Samfurin Bayanin Samfura Mai haɗa katin katin Micro SD tura tura,H1.85mm,Material Rufe Kullum: Gidaje:LCP,UL94V-0,Baƙar fata. Lamba: Phosphor Bronze. Saukewa: SUS304. Lantarki: Resistance lamba:100mΩ Max. Dielectric Tsayayyen Wutar Lantarki: 500V AC Max tare da Minti 1. Juriya na Insulation: 1000MΩ Min. Matsayin Yanzu: 0.5mA AC/DC max. Ƙimar Wutar Lantarki: 100V RMS Min. Ƙarfin Mating: 13.8N Max. Ƙarfin Ƙarfi: 13.8N Min. Ƙarfin Resistance Tuntuɓi: 100g Min.Per Pin. Yanayin Aiki: -45ºC~+...
Mai haɗa katin Micro SD tura tura, H1.85mm, Kullum rufe KLS1-TF-001
Hotunan Samfurin Bayanin Samfuran Mai haɗa katin katin Micro SD, turawa,H1.85mm,Kayan aiki na yau da kullun: Rufewa:Housing:High Temperate Thermoplastic,UL94V-0,Black. Contact: Copper Alloy . Shell: Bakin Karfe, Nickle. Lever: Bakin Karfe, Nickle. Lokacin bazara: Pianowire, Nickle. Plating: Underplate:Nickel. Wurin tuntuɓar: Zinare akan Nikel. Wurin saida: Tin akan nickel.
Mai Haɗin Katin SIM Biyu, PUSH PULL, H3.0mm KLS1-SIM2-002A
Hotunan Samfura Bayanan Samfura Mai Haɗin Katin SIM Biyu, PUSH PULL, H3.0mm Material: Gidaje: Hi-TEMP Filastik, UL94V-0.Black. Terminal: Copper alloy Shell: Bakin Karfe Gama: Terminal: Au Plated a kan wurin lamba, Matte tin plated a kan wutsiyar solder da ke ƙasa a kan nickel Shell: Au Plated akan wutsiyar solder da ke ƙarƙashin nickel Electric: Resistance Contact: 50mΩ Max Tsarewar ƙarfin lantarki: 350V ACΩ juriya ...
2 A cikin 1 Micro SIM & Mai Haɗin Katin SD, 8P, H2.26mm KLS1-SIM-109
Hotunan Samfura Bayanan Samfura 2 A cikin 1 Micro SIM & Mai Haɗin Katin SD, 8P, H2.26mm Material: Insulator: High Temp Thermoplastic, UL94V-0.Black. Tasha: Alloy Copper, Zinariya a wurin lamba 1u”, Yanki mai gilding 1u” Babban Shell: Bakin Karfe, Plate Nickel 50u” Harsashi ƙasa: SUS304 R-1/2H T=0.10mm, Plate Nickel 50u”. Wutar Lantarki: Ƙarfin Saka 1kgf Max.Ƙarfin Cire 0.1kgf Min. Ƙarfafa: Kewayoyin SIM 5000, Resistance Tuntuɓi: Kafin gwaji 80mΩ Max, Bayan...
Mai Haɗin Katin SIM Biyu, PUSH PULL, H3.0mm KLS1-SIM-033
Hotunan Samfur Bayanin Samfura Mai Haɗin Katin SIM Biyu, PUSH PULL, H3.0mm Material: Gidaje: Filastik mai zafi mai zafi, UL94V-0.Back. Terminal: Tasakiya Alloy.Golol Flash Plated akan Duk Terminal, Minis "Mid Nickel a ko'ina, walƙiya a ko'ina. Lantarki: Matsayin Yanzu: 0.5 A. Ƙimar wutar lantarki: 5.0 vrms. Juriya na Insulation: 1000MΩ Min.At DC500V DC. Tsare-tsare Wutar Lantarki:250V AC RMS Na Minti 1. Tuntuɓar...
2 A cikin 1 Katin SIM + Mai Haɗin Micro SD, PUSH PULL, H2.7mm KLS1-SIM-024
Hotunan Samfura Bayanin Samfura 2 A cikin Katin SIM 1 + Mai Haɗin Micro SD, PUSH PULL, H2.7mm Wutar Lantarki: Voltage: 100V AC Yanzu:0.5A Max. Resistance lamba: 100mΩ Max. Dielectric Tsarewar Wutar Lantarki: 500V AC. Juriya na Insulation:1000MΩ Min Injini: Ƙarfin Saka Kati:13.8N Max. Tura A Ƙarfi:19.6N Max. Durability: 10000 Zagaye. Yanayin Aiki: -45ºC~+85ºC Lantarki: Wutar Lantarki:100V AC Yanzu:0.5A Max. Resistance lamba: 100mΩ Max. Dielectric Juriya...
Mai Haɗin Katin Nano SIM; PUSH PULL, 6Pin, H1.40mm KLS1-SIM-113
Hotunan Samfura Bayanan Samfura Nano Mai Haɗin Katin SIM;PUSH PULL,6Pin,H1.40mm Material: Insulator:LCP,UL94V-0. Contact:C5210.Plated 50u”Ni Overall,Lambobin All Au 1u. Shell:SUS,Plated 50u”Ni Overall,PAD Au 1u. Lantarki: Matsayin Yanzu: 0.5A AC/DC max. Ƙimar wutar lantarki:30V AC/DC Resistance lamba:30mΩ Max. Resistance Insulation:1000MΩ Min Zazzabi Mai Aiki: -45ºC~+85ºC
Mai Haɗin Katin SIM Nano, PUSH PUSH, 6Pin, H1.37mm, tare da CD Pin KLS1-SIM-066
Hotunan Samfura Bayanin Samfura Nano Mai Haɗin Katin SIM, PUSH PUSH, 6Pin, H1.37mm, Tare da Kayan CD Fil: Insulator: Babban Zazzabi Thermoplastic, UL94V-0. Contact: Copper Alloy, Plated 50u" Ni Overall, PAD Au 1u". Shell:SUS.All Ni 30U/MIN. Wutar Lantarki: Ƙimar Yanzu: 0.5A ampers Ƙimar Wutar Lantarki:5V AC/DC Resistance lamba:100mΩ Max. Juriya na Insulation:1000MΩ Min./500V DC Yanayin Aiki: -45ºC~+85ºC
Mai Haɗin Katin Nano SIM, PUSH PUSH, 6Pin, H1.25mm, tare da CD Pin KLS1-SIM-103
Hotunan Samfura Bayanin Samfura Nano Mai Haɗin Katin SIM, PUSH PUSH, 6Pin, H1.25mm, tare da Kayan CD na Fil: Lamba: Alloy na Copper.Au sama da Ni. Gidaje: Gilashin Cikakkiyar LCP. Shell:Stainless.Au bisa Ni.GND Frame:Copper Alloy.Au bisa Ni. Canja Gane: Alloy Copper.Au akan Ni.Slide: Gilashin Cika Pa10t. Spring: Bakin. Kugiya: Bakin. Wutar Lantarki: Ƙididdigar halin yanzu: 0.5A Matsakaicin Ƙarfin Wutar Lantarki: 30V Adawar AC: 100mΩ Max. Juriya na Insulation:1000MΩ Min./500VDC Dielectric Tsayayyen Wutar Lantarki:500...
Nano SIM Card Connector, Nau'in Tire, 6Pin, H1.55mm, tare da CD Pin KLS1-SIM-104
Hotunan Samfura Bayanan Samfura Nano Mai Haɗin Katin SIM, Nau'in Tire, 6Pin, H1.55mm, Tare da Wutar Lantarki na CD: Matsayin Yanzu:1 Amp/Pin.MAX. Ƙarfin wutar lantarki:30V DC.MAX Ƙarƙashin Ƙarfafa Tuntuɓar Sadarwa:30mΩ Max.Da farko. Dielectric Tare da Wutar Lantarki: 500V AC MIN.Na minti 1. Juriya na Insulation:100MΩ Min.500V DC .Na minti 1. Durability: 1500 Zagaye. Yanayin Aiki: -45ºC~+85ºC
Nano SIM Card Connector, Nau'in tire, 6Pin, H1.5mm, tare da CD Pin KLS1-SIM-102
Hotunan Samfura Bayanin Samfura Nano Mai Haɗin Katin SIM, Nau'in Tire, 6Pin, H1.5mm, Tare da Wutar Lantarki na CD: Matsayin Yanzu:1 Amp/Pin.MAX. Ƙarfin wutar lantarki:30V DC.MAX Ƙarƙashin Ƙarfafa Tuntuɓar Sadarwa:30mΩ Max.Da farko. Dielectric Tare da Wutar Lantarki: 500V AC MIN.Na minti 1. Juriya na Insulation:100MΩ Min.500V DC .Na minti 1. Durability: 1000 Zagaye. Yanayin Aiki: -45ºC~+85ºC
Nano SIM Card Connector;MID Dutsen Tray type,6Pin,H1.5mm,tare da CD Pin KLS1-SIM-100
Hotunan Samfura Bayanin Samfura Nano Mai Haɗin Katin SIM;MID Nau'in Dutsen Tire,6Pin,H1.5mm,tare da CD Fil Material: Filastik:LCP,UL94V-0.Black. Tuntuɓi: C5210 Shell: SUS304 Tire: LCP, UL94V-0.Black. Plating: Contact: Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u”Ni Solderable 30u”Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.- English
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